Patent:
Patent Family:: 050193491
DE102013211304A1, WO2014202237
12/2014
Inspecting materials or structures for internal flaws using traditional ultrasound equipment often involves a trade-off, as a single probe size struggles to provide clear imaging at both shallow and deep distances. This new invention solves that problem by using a specially designed array of ultrasonic transducers that combines both large and small elements in a single device. The smaller elements are optimized to detect flaws close to the surface with high resolution, while the larger elements are tailored to send sound waves deeper into the material for long-range inspection. By automatically matching the right transducer size to the required inspection depth, this smart phased-array technology significantly improves the overall accuracy and reliability of non-destructive testing.